Apple’s favorite chip foundry, Taiwan Semiconductor Manufacturing Company (TSMC), is about to kick off volume production of a new Apple-designed A11 chip widely expected to serve as the engine for new iOS devices this year, including an all-new iPhone 8 with an OLED display and the iterative iPhone 7s and iPhone 7s Plus with LCD screens.
iPhone and iPad silicon maker Taiwan Semiconductor Manufacturing Company Limited (TSMC) won’t make the decision whether or not it would build a foundry fab in the United States until sometime in 2018, Reuters reported Monday. The firm hinted it might start building some of the chips in America.
TSMC, which exclusively churns out Apple-designed mobile processors for latest iPhone and iPads, won’t make a definite decision on building a US plant this year because it would lose its “flexibility” if it made the move this year.
Semiconductor foundry Taiwan Semiconductor Manufacturing Company (TSMC) is kicking off commercial shipments of chips built on its new ten-nanometer process technology, ahead of iPhone 8, sources told Taiwanese trade publication DigiTimes. TSMC is building iPhone 7’s A10 Fusion chip and is said to have landed an exclusive contract to manufacture processors for 2017 iPhone and iPad models.
As we reported this morning, iPhone manufacturer Foxconn and its Japanese subsidiary Sharp are considering setting up an $8 billion LCD panel production plant in the United States. According to another report, semiconductor maker Taiwan Semiconductor Manufacturing Company Limited (TSMC) has also expressed interest in taking advantage of business-friendly incentives proposed by incoming U.S. President Trump.
As a reminder, TSMC currently churns out Apple-designed silicon for latest iOS devices and is also said to have landed a lucrative contract to build next-generation A11 chips for future Phones and iPads.
Trade publication DigiTimes said Friday that Taiwan Semiconductor Manufacturing Company (TSMC) has received orders to kick off volume production of Apple-designed A10X Fusion chips for the next iPad. However, unsatisfactory yields for TSMC’s 10-nanometer process technology could disrupt planned March 2017 launch of the next iPad series.
The proportion of semiconductor devices on the silicon wafer found to perform properly is referred to as the yield. Yield rates in semiconductor fabrication can be as low as thirty percent due to process variation and many other reasons.
Chip manufacturer Taiwan Semiconductor Manufacturing Company Limited (TSMC) today posted record profits and its shares have climbed to their highest level on record as strong demand for the iPhone 7 and iPhone 7 Plus fuels orders for the handsets’ in-housed designed A10 Fusion processor. That TSMC is the sole supplier of the A10 has no doubt helped it capture record profits amid a global slowdown in the smartphone market.
Taiwan Semiconductor Manufacturing Company Limited (TSMC), which builds Apple’s in-house designed A10 Fusion chip that powers the iPhone 7, has confirmed mass production of ten-nanometer chips for clients will kick off by year-end, beating Intel by almost a year in terms of high-performance silicon.
Chip maker Intel’s own ten-nanometer chips are due in second half of 2017.
Both in-house designed ‘A10’ and ‘A11’ chips for this year’s iPhone 7 and 2017 iPhones/iPads, respectively, are believed to be manufactured solely by Taiwan’s semiconductor foundry TSMC (sorry, Samsung).
According to Nikkei Asian Review, Intel is now perfectly poised to give TSMC a good run for its money in as little as two years because any Apple chips after the A10/A11 should be fabricated by Intel.
The recently signed licensing deal between Intel and UK-based ARM Holdings lets the former fabricate chips for smartphones based on the latter’s CPU technology.
TSMC is believed to have secured orders for an Apple-designed ‘A11’ system-on-a-chip expected to power so-called Tenth Anniversary iPhone and new iPads in 2017, trade publication DigiTimes reports. The chip should be fabricated on TSMC’s ten-nanometer process technology and use its backend integrated fan-out (InFO) wafer-level packaging technology. Additionally, TSMC should build Apple-designed circuitry to drive 2017 iPhone’s AMOLED panel.
An Apple-designed ‘S2’ system-in-package that will power a second-generation Apple Watch won’t be produced by Samsung, like the original Apple Watch’s S1 chip. According to a new report by Taiwanese trade publication DigiTimes, semiconductor foundry Taiwan Semiconductor Manufacturing Company (TSMC) has managed to beat Samsung in securing S2 orders. In fact, both the second-generation Apple Watch and an enhanced version of the original Apple Watch will be driven by the S2 chip, built using TSMC’s 16-nanometer process technology.