iPhone 7

KGI predicts A10 chip with 3GB of RAM in iPhone 7

The next year's iPhone, let's call it an 'iPhone 7,' is expected to be outfitted with three gigabytes of RAM, according to the revered analyst Ming-Chi Kuo of KGI Securities. If true, the iPhone 7 will pack in fifty percent more RAM than this year's iPhone 6s and iPhone 6s Plus that sport 2GB of RAM.

According to Kuo' note issue to clients Wednesday, a copy of which was obtained by AppleInsider, this will help the new phone multitask even better than the current iPhone 6s, which has doubled the amount of RAM relative to last year's iPhone 6 and iPhone 6 Plus.

Decoding iPhone 7 chip architecture…

Apple is thought to become the first customer that will take advantage of Taiwan Semiconductor Manufacturing Company's (TSMC) InFO chip manufacturing process in building in-house designed A10 chips for 2016 iOS devices, potentially allowing it to trim some fat off the next iPhone model.

Taking a step back to take a look at the bigger picture, we analyze Apple's chip efforts thus far and make educated guesses as to what advances in terms of silicon design and integration the next iPhone might allow.

We'll also reflect on how having the foresight to take its chip destiny into its own hands more than five years ago has helped Apple differentiate itself from competition.

Intel has 1,000 engineers working on integrated LTE modem for iPhone 7

According to a report this weekend from VentureBeat, chip giant Intel has assembled a team of 1,000 engineers who are working hard on adapting its LTE modem for an 'iPhone 7.'

The move potentially indicates a major loss for Qualcomm, which supplied LTE modems for the iPhone 6s and iPhone 6s Plus and previous iPhones. Intel's lauded 7360 LTE modem chip is being reworked for an iPhone, the story asserts.

Moreover, VentureBeat claims that Apple could, for the first time ever, embed the modem chip into its in-house designed A-series system-on-a-chip, resulting in an even tighter component integration.

How to get your iPhone on Friday morning at 8am sharp

It's the same dilemma every year. You want the new iPhone as soon as possible, but don't want to spend the night waiting in line to get it. As much as I love Apple crowds, I'd rather spend the night in my bed.

Even if you ordered your iPhone for delivery, there is always a chance the UPS guy won't come by your house until later in the day, which means you could still be left hanging there for several excruciating hours. First world problems indeed!

Thankfully, if you've ordered your iPhone for delivery, we have a trick that may help you score your iPhone first thing in the morning, as soon as 8am.

Apple reportedly commissions TSMC to exclusively build in-house designed ‘A10’ chips for ‘iPhone 7’

The iPhone 6s featuring Apple's in-house designed 'A9’ microchip is yet to start shipping but the firm's already commissioned Taiwan Semiconductor Manufacturing Company (TSMC) to build a next-generation 'A10’ package expected to power 2016 iOS devices like an 'iPhone 7,’ third-generation iPad Air and second-generation iPad Pro, according to supply chain chatter Monday.

iPhone 7 rumored to switch back to using glass-on-glass screen technology

Unhappy with the in-cell screen process used in production of iPhone displays which is plagued with lower touch sensitivity on screen edges, Apple is reportedly considering a return to glass-on-glass (G/G) touchscreen panels for an 'iPhone 7,' a technology it ditched with the release of the iPhone 5 in the fall of 2012.

According to a somewhat sketchy report published Wednesday by DigiTimes, Apple is currently sampling glass-on-glass touch samples for 2016 iPhones.

If true, the iPhone 7—or whatever a 2016 iPhone ends up being named—will feature better touch accuracy, improved Multi-Touch performance and better touch detection on screen edges. In addition, glass-on-glass technology would permit the company to develop a bezel-free iPhone and support 4K resolutions.

TSMC establishing 10nm pilot line to build A10 chips for iPhone 7

Taiwan Semiconductor Manufacturing Company Limited (TSMC), the world's largest dedicated independent semiconductor foundry, is apparently scheduled to finish its 10-nanometer pilot production line by the end of June, with Taiwanese media suggesting that the new facilities will churn out an Apple-designed ‘A10’ processor said to power an ‘iPhone 7’ and other iOS devices due in 2016.

Samsung apparently lands contract to produce A9 chips for iPhone 7 in 2015

The Wall Street Journal recently ran a report claiming that Apple has finally inked a deal with TSMC, or Taiwan Semiconductor Manufacturing Co., to produce chips for iDevices, after the foundry met Apple’s requirements for speed and power usage. Pundits are adamant the agreement put the final nail in the coffin of the Apple-Samsung relationship.

They should hold their horses: it now seems Samsung has wrestled back some of the control amid talk its components arm will indeed produce sophisticated A9 chips to power Apple's iPhone 7 in 2015...