iPhone 6s Colors

The iPhone 6s featuring Apple’s in-house designed ‘A9’ microchip is yet to start shipping but the firm’s already commissioned Taiwan Semiconductor Manufacturing Company (TSMC) to build a next-generation ‘A10’ package expected to power 2016 iOS devices like an ‘iPhone 7,’ third-generation iPad Air and second-generation iPad Pro, according to supply chain chatter Monday.

The A10 application processor will be exclusively manufactured by TSMC on its 16-nanometer manufacturing process using InFO (Integrated Fan Out) architecture.

“The iPhone 7 should be introduced in Q4 2016, and Apple’s supply chain will apparently begin stocking up on components sometime in the second quarter,” reads the report.

Some of the benefits of the InFO process technology include reduced cost and streamlined manufacturing while potentially allowing Apple to engineer iPhones and iPads using the Apple Watch’s system-in-package (SiP) design.

The SiP design of the Apple Watch’s  28-nanometer ‘S1’ chip basically packs an entire computer architecture onto a single chip by combining the processor, the GPU, RAM, the logic board, the sensors and all of the supporting circuitry—more than 30 different components—into a resin-covered package.

The iPhone 6s and iPhone 6s Plus feature a notable reduction of chips compared to the previous-generation. However, should all of the iPhone’s chips—including the CPU, the GPU, RAM, the sensors, storage, various controllers and other electronic parts—be shrank to fit a single encapsulated module like on the Apple Watch, the approach would eliminate the need for the traditional printed circuit board and allow 2017 iPhones to be even thinner while potentially gaining water resistance.

iPhone 6s a9

The A9 chip—and all of Apple’s previous A-series chips—combines the CPU, the GPU, RAM and control logic onto a single chip. Apple’s latest processors, the A9 and A9x, power the new iPhones and the iPad Pro, respectively.

The company states that the A9 has 70 percent CPU performance and 90 percent more graphics performance compared to its predecessor, the A8.

Among other things, the A9 combines an improved image processor with better temporal and spatial noise reduction and improved local tone mapping. It also embeds the M9 motion coprocessor whereas on previous-generation iOS devices the motion coprocessor is a own chip separate from the main processor.

Source: China Times (Google Translate) via G for Games

  • DevXav

    Hmmm, if that report is really true, then a “pattern” is gonna be broken..

    Apple used to upgrade the processors on the S line..

    See a new processor on the non-S line is something new!

    • m1n1cooper

      Apple’s system-on-chip has been updated for every device since the iPhone 4 which started at the A4 chip, iPhone 4S was A5, iPhone 5/5C was A6, iPhone 5S was A7, iPhone 6/6+ was A8 and the new iPhone 6S/6S+ is going to be A9

      • DevXav

        If you take a closer look, the SIGNIFICANT hardware/performance changes always come with the S version, thus, the non-S versions processors, even being named as “new”, are in essence a kind of “overclock”.

        5S: Dual-core 1.3 GHz Cyclone (ARM v8-based)
        6: Dual-core 1.4 GHz Cyclone (ARM v8-based)

        Same happened from iPhone 4S to 5

        4S: Dual-core 1 GHz Cortex-A9
        5: Dual-core 1.3 GHz Swift (ARM v7-based)

        iPhone 4 was a Single Core 1 GHz Cortex-A8.

      • Dalton

        My first iPhone was the 4S, I’ve had every S model since & I don’t plan on changing now. I will take the hardware upgrades EVERY time over the design “changes” from the standard number-only models

  • Ricky

    I was really hoping the next generation of chips would be called B1.