Both in-house designed ‘A10’ and ‘A11’ chips for this year’s iPhone 7 and 2017 iPhones/iPads, respectively, are believed to be manufactured solely by Taiwan’s semiconductor foundry TSMC (sorry, Samsung).
According to Nikkei Asian Review, Intel is now perfectly poised to give TSMC a good run for its money in as little as two years because any Apple chips after the A10/A11 should be fabricated by Intel.
The recently signed licensing deal between Intel and UK-based ARM Holdings lets the former fabricate chips for smartphones based on the latter’s CPU technology.
TSMC is believed to have secured orders for an Apple-designed ‘A11’ system-on-a-chip expected to power so-called Tenth Anniversary iPhone and new iPads in 2017, trade publication DigiTimes reports. The chip should be fabricated on TSMC’s ten-nanometer process technology and use its backend integrated fan-out (InFO) wafer-level packaging technology. Additionally, TSMC should build Apple-designed circuitry to drive 2017 iPhone’s AMOLED panel.
Taiwanese component makers are currently scrambling to fulfill orders as the Cupertino firm is getting ready to kick off production of this year’s upcoming iPhones and iPads.
Moreover, Apple’s engineers should now be close to completing work on a 2017 iPhone and have certainly been developing a 2018 iPhone for some time now.
Trade publication DigiTimes wrote in a new report that Taiwan Semiconductor Manufacturing Company Limited (TSMC), a foundry that builds chips for Apple, has now taped out an Apple-designed ‘A11’ chip that will power 2017 iPhones and iPads.