Another significant bottleneck in mass production of the TrueDepth camera system for iPhone X has been removed with news that Taiwanese supplier Himax Technologies has now started shipments of a key Face ID component to Apple.

Taiwanese trade publication DigiTimes reported Thursday that the Face ID sensor relies on Himax’s chips which are based on wafer-level optics technology (WLO).

Back in March, Barrons reported that Himax had been contracted to build a chip for a 3D depth-sensing module for Apple’s OLED device. Another supplier, Taiwan’s¬†ChipMOS Technologies, has partnered with Himax for iPhone X’s WLO chips.

Both vendors should enjoy a pull-in of orders for WLO chips next year when Android vendors are expected to follow suit by equipping their phones with iPhone X-like facial recognition.

Interestingly, Qualcomm’s recently-announced 3D depth sensing solution, targeted at the Android camp, was jointly developed with Himax.

Analysts have cautioned that iPhone X launch supply could be constrained¬†due to poor yields with the TrueDepth camera, but the situation is set to improve given the promising outlook for WLO chip demand as Android vendors are¬†clamoring to copy Apple’s TrueDepth invention.