Semiconductors

iPhone modem supplier Qualcomm countersues Apple

iPhone modem supplier Qualcomm is countersuing Apple in the U.S. District Court for the Southern District of California, saying the Cupertino company could not have “built the incredible iPhone franchise” without its fundamental cellular technologies. The chip maker accused Apple of contributing “virtually nothing” to the development of core cellular technologies.

Analyst predicts Apple will build its own power management chips for iPhones by 2019

Apple’s been designing mobile chips for iOS devices in-house since 2010 and could soon be making its own GPUs as well. But one analyst predicts that the California company is set to build its own iPhone power management chips, too, within two years.

Analyst Karsten Iltgen with German investment bank Bankhaus Lampe wrote in a note to clients Tuesday, a copy of which was obtained by Bloomberg, that there is “strong evidence” that Apple is developing its own power-management integrated circuits that should replace the chip made by Dialog Semiconductor “at least in part”.

Three major Apple suppliers have submitted preliminary bids for Toshiba’s flash chip business

In the coming weeks, Toshiba will unveil a final decision concerning selling a majority stake in its lucrative memory business. Bloomberg reported this morning that iPhone manufacturer Foxconn’s preliminary bid for Toshiba’s semiconductor unit is valued at a whopping $26.93 billion. According to Bloomberg’s sources, that amount is in part to force negotiations, using a bid that’s too high to ignore.

SK Hynix unveils 72-layer 256Gb 3D NAND flash memory chips suitable for future iPhones

Apple supplier SK Hynix unveiled 72-layer, 256-gigabit (Gb) 3D NAND flash memory chips based on triple-level cell arrays. By stacking 1.5 times more cells than the company’s previous 48-layer technology, a single 256Gb NAND flash chip can represent 32 gigabytes of storage with two times faster internal operation speed and twenty percent faster read/write performance than a 48-layer 3D NAND chip.

Apple is developing its own GPU chips

In a bombshell press release issued Monday, UK chip designer Imagination Technologies said Apple told it that it would end a fruitful deal to use Imagination’s blueprints for customized graphics cores in its own A-series chips powering iPhone, iPad, iPod touch, Apple Watch and Apple TV devices.

Apparently, the Cupertino company is now looking to create independent GPU designs that could be ready in about two year’s time. Shares of Imagination immediately plunged over 70 percent to their lowest level since the financial crisis in 2009, wiping over $625 million off the company’s market value.

Apple, Amazon and Google in the bidding war to acquire Toshiba’s flash chip unit

Although Toshiba saw strong overall results from its HDD/SSD business in 2016, it’s spinning off the lucrative NAND flash unit into a separate company. It’s a last-ditch effort to plug a gap after the firm reported a heavy one-off $6.3 billion loss in December 2016, prompting its chairman to resign.

Korean Herald cited yesterday’s report in Yomiuri Shimbun Daily claiming that Apple, Amazon and Google are engaged in a bidding war to acquire the Japanese giant’s NAND flash unit. A very diverse conglomerate, Toshiba is Apple’s top supplier of memory chips for iOS devices and files as the second-largest flash chip maker in the world after Samsung Electronics.

TSMC could spend $16+ billion on US chip plant, final decision in the first half of 2018

iPhone and iPad silicon maker Taiwan Semiconductor Manufacturing Company Limited (TSMC) won’t make the decision whether or not it would build a foundry fab in the United States until sometime in 2018, Reuters reported Monday. The firm hinted it might start building some of the chips in America.

TSMC, which exclusively churns out Apple-designed mobile processors for latest iPhone and iPads, won’t make a definite decision on building a US plant this year because it would lose its “flexibility” if it made the move this year.

Foxconn and TSMC joining together to bid for Toshiba’s flash memory business

Aside from other firms, companies like storage maker Western Digital, iPhone manufacturer Foxconn and Apple mobile chip maker Taiwan Semiconductor Manufacturing Company (TSMC) have all been named as potential bidders seeking a stake in Toshiba’s memory business.

According to a new report in the Chinese-language Liberty Times, quoted by DigiTimes, Foxconn and TSMC are joining forces in an attempt to acquire a majority stake in Toshiba’s NAND flash business. A successful bid by the two Apple suppliers may pose a great challenge to Samsung Electronics’ leadership in the flash memory market.

iPhone chip maker TSMC also eyeing Toshiba’s flash memory business

According to DigiTimes, Apple chip maker Taiwan Semiconductor Manufacturing Company (TSMC) is also interested in acquiring a stake in Japanese giant Toshiba’s memory business. The semiconductor foundry has been looking to expand into the lucrative 3D NAND memory sector.

Apple’s top supplier of memory chips, Toshiba is looking to spin off its flash unit into a separate company after reporting a massive $6.3 billion loss, with the split to become effective on April 1, 2017.

Firms like storage maker Western Digital and iPhone manufacturer Foxconn are among the potential bidders seeking a stake in Toshiba’s memory business, too.

Foxconn serious about bidding for Toshiba’s memory chip business

Contract manufacturer Foxconn Technology Group, which assembles Apple’s iPhones and other companies’ products, is “very serious” about bidding for Toshiba’s memory chip business. Toshiba is currently Apple’s top supplier of flash memory chips. Foxconn’s founder and chairman Terry Gou said the firm cannot afford not having this technology.

Toshiba recently moved to sell some or all of its memory chip business after reporting a massive $6.3 billion loss. According to Bloomberg, Gou was present at an event in southern China to open a new $9 billion display plant.

TSMC kicking off commercial shipments of 10-nanometer chips next month

Semiconductor foundry Taiwan Semiconductor Manufacturing Company (TSMC) is kicking off commercial shipments of chips built on its new ten-nanometer process technology, ahead of iPhone 8, sources told Taiwanese trade publication DigiTimes. TSMC is building iPhone 7’s A10 Fusion chip and is said to have landed an exclusive contract to manufacture processors for 2017 iPhone and iPad models.