Following iFixit's analysis of the components and internal layout changes in the iPhone 7 Plus, semiconductor experts over at Chipworks and TechInsights have performed a joint in-depth analysis of the chips in the 128GB iPhone 7 model “A1778” to identify the key integrated circuits at play.
The Apple-designed A10 Fusion chip is “incredibly thin,” Chipworks has discovered, thanks to TSMC's InFO packaging technique resulting in a thinner package. Perhaps more interesting than that, the AT&T and T-Mobile edition of the handset indeed comes with Intel's LTE modem inside versus Qualcomm's that powers cellular connectivity in other hardware versions of the device.