By Christian Zibreg on Oct 8, 2015
For the first time ever, Apple has dual-sourced the engine that drives the new handsets from more than one supplier. Both Samsung and rival Taiwan Semiconductor Manufacturing Company (TSMC) won contracts to build the Apple-designed ‘A9’ system-on-a-chip for the new iPhone 6s and iPhone 6s Plus.
While these chips offer literally the same compute and graphics power, both synthetic benchmarks and real-life tests have shown small yet notable difference in terms of battery as the TSCM-built A9 appears to be more power efficient than its Samsung counterpart.
The question is, does your brand spanking new iPhone 6s have the TSMC or Samsung-built chip? You can find that out in just a few simple steps, let me show you how. Read More
By Christian Zibreg on Oct 8, 2015
Does your iPhone 6s or iPhone 6s Plus come outfitted with Samsung or TSMC-built A9 processor? The answer to that question could determine how long your device will run before its battery needs recharging.
Your key takeaway is this: while the dual-sourced chips perform identically in synthetic Geekbench tests in terms of sheer CPU compute power and GPU performance, there’s a marked difference in observed battery life ranging from six to eleven percent.
You could argue the difference is barely felt in day-to-day use, but I beg to differ: energy efficiency is paramount for mobile devices and the battery-friendlier the main processor is, the longer it will run on a single charge. Read More
By Christian Zibreg on Sep 29, 2015
An initial analysis of the Apple-designed A9 system-on-a-chip powering the new iPhone 6s and iPhone 6s Plus, conducted by semiconductor experts over at Chipworks, has identified both Samsung and rival Taiwan Semiconductor Manufacturing Company as manufacturers of the package.
What’s really interesting is that the A9 comes in two sizes, depending on who manufactured it, with the Samsung-built units being a bit smaller than those manufactured by TSMC. This is the first time an Apple-designed processor for an iPhone came in two different sizes. Read More
By Christian Zibreg on Sep 21, 2015
Facedown detection stands as one of the underrated features in iOS 9’s rich arsenal of power-saving tactics designed to help extend your run time by up to an additional hour.
Facedown detection avoids turning the display on when a notification comes in and your phone is put facedown. But as it turns out, Facedown detection doesn’t work on all devices compatible with iOS 9 and there is a good explanation for that why. Read More
By Christian Zibreg on Sep 14, 2015
The iPhone 6s featuring Apple’s in-house designed ‘A9’ microchip is yet to start shipping but the firm’s already commissioned Taiwan Semiconductor Manufacturing Company (TSMC) to build a next-generation ‘A10’ package expected to power 2016 iOS devices like an ‘iPhone 7,’ third-generation iPad Air and second-generation iPad Pro, according to supply chain chatter Monday. Read More
By Christian Zibreg on Aug 26, 2015
Samsung lifted trade secrets from rival Taiwan Semiconductor Manufacturing Company Limited (TSMC), the world’s #1 independent semiconductor foundry, Taiwan’s top court has ruled.
According to a report published Wednesday by Taiwanese trade publication DigiTimes, the court has determined that Liang Mong-song, a former senior director of research and development at TSMC, revealed TSMC’s trade secrets and patents related to its advanced FinFET process technology to Samsung Electronics.
The report makes no mention of Apple, but the connection couldn’t be clearer: Samsung might have been able to leverage the stolen secrets to win orders for Apple’s next-generation ‘A9’ processor. Prior reports have posited that both Samsung and TSMC got to build Apple’s A9 chips on the advanced 14-nanometer FinFET process technology which uses entirely new three-dimensional transistors. Read More
By Christian Zibreg on Jul 29, 2015
Chip makers Intel and Micron today announced a major breakthrough in memory process technology which promises to increase the performance of NAND flash chips by a factor of 1,000.
The name of this game-changing technology is 3D Xpoint, pronounced as “crosspoint”. Not only does it enable 1,000 times faster performance, but has up to 1,000X greater endurance than NAND flash and is 10X denser than conventional memory.
By comparison, today’s solid state drives typically offer between a hundred to up to a thousand times faster seek times versus traditional hard drive technology. Just don’t count on Intel’s new ultra-fast flash storage appearing in the next iPhone because a claimed logic board for an ‘iPhone 6s’ shows 19-nanometer flash memory chips by Toshiba. Read More
By Christian Zibreg on Jul 16, 2015
Volume production of an Apple-designed next-generation “A9” chip, the engine that will power the next iPhone and iPad, has begun at facilities operated by Samsung and Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest independent semiconductor foundry.
According to a report published Friday by DigiTimes, a semi-accurate Taiwanese trade publication, the two rivals get to share orders and both have now started volume production of the chips.
Supply chain sources interviewed by The Wall Street Journal estimate Apple’s ordered a record 80 million units of the iPhone 6s and iPhone 6s Plus units by the end of 2015. Read More
By Christian Zibreg on Jul 3, 2015
A leaked logic board has already offered a valuable insight into some of the many hardware enhancements in Apple’s upcoming ‘iPhone 6s’ and ‘iPhone 6s Plus’ refreshes. Thus far, we have learned about Qualcomm’s new baseband modem which doubles LTE download speeds, a slightly thicker enclosure to accommodate Force Touch sensors and possibly a higher-resolution Retina screen.
9to5Mac has teamed up with semiconductor experts at Chipworks in an effort to identify other chips and components based on images of an alleged iPhone 6s motherboard.
Here are their findings. Read More
By Christian Zibreg on Jul 1, 2015
Apple’s next iPhone should double LTE download speeds from a theoretical maximum of 150Mbps on the present-generation iPhone 6 and iPhone 6 Plus up to 300Mbps on the next-generation ‘iPhone 6s’ and ‘iPhone 6s Plus,’ according to a purported logic board leaked by 9to5Mac.
A photo of the alleged ‘iPhone 6s’ logic board shows a chip identified as the MDM9635M module from Qualcomm, part of its ‘Gobi’ modem platform. Read More
By Christian Zibreg on Jun 11, 2015
A new rumor from Asia suggests that Taiwan Semiconductor Manufacturing Company (TSMC), one of the world’s largest semiconductor foundries, is ready to kick off mass production of Apple’s in-house designed ‘A9’ mobile processor for the new iPhones, tentatively called an ‘iPhone 6s’ and ‘iPhone 6s Plus’.
At the same time, another rumor from Apple’s supply chain has reaffirmed that 2015 iPhones will have a chassis made from 7000 Series aluminum, a custom alloy the Cupertino firm originally developed for the Apple Watch Sport. Read More
By Christian Zibreg on May 26, 2015
Taiwan Semiconductor Manufacturing Company Limited (TSMC), the world’s largest dedicated independent semiconductor foundry, is apparently scheduled to finish its 10-nanometer pilot production line by the end of June, with Taiwanese media suggesting that the new facilities will churn out an Apple-designed ‘A10’ processor said to power an ‘iPhone 7’ and other iOS devices due in 2016. Read More
By Christian Zibreg on May 7, 2015
At the heart of the Apple Watch is Apple’s in-house designed ‘S1’ component that literally puts an entire computer architecture onto a single chip — an industry term you’re looking for is system-in-package (SiP) design.
A recent teardown analysis by ABI Research has managed to identify 512MB of RAM, an ARM-based CPU, a Broadcom Wi-Fi module, an accelerometer and gyroscope, along with a few other components, packed inside the S1.
Today, semiconductor experts over at Chipworks have updated their teardown of the S1 package with a few interesting tidbits related to the type of process technology used while revealing some rather unique design solutions making such small yet powerful package possible. Read More
By Christian Zibreg on Apr 30, 2015
The Apple Watch is driven by Apple’s in-house designed system-in-package (SiP) processor, called S1. Laying flat in the bottom of the Watch casing, it integrates many subsystems into one remarkably compact module, essentially miniaturizing an entire computer architecture onto a single chip.
Because it’s completely encapsulated in resin to protect the electronics, neither experienced teardown wizards over at iFixit nor semiconductor experts at Chipworks were able to take a detailed look at the S1 innards without basically destroying the package.
Thankfully, ABI Research saw to that.
Thursday, the research firm has published its teardown analysis which delves into the S1 to identify a number of individual components that make up the SiP. Here’s what they found. Read More
By Christian Zibreg on Mar 26, 2015
TSMC, or Taiwan Semiconductor Manufacturing Company Limited, is expected to remain the major supplier of Apple’s in-house designed processors for the upcoming iPhone 6s and iPhone 6s Plus.
In addition, the world’s largest independent semiconductor foundry is said to supply 20-nanomenter chips for an upcoming iPhone 6c model, expected to arrive as Apple’s new entry-level iPhone with a price tag between $400 and $500.
An Apple-designed system-on-a-chip for the next-generation iPhone 6s and iPhone 6s Plus models should be called the ‘A9’ and will be built on TSMC’s 16-nanometer FinFET process technology, industry sources told DigiTimes. Read More
By Christian Zibreg on Feb 26, 2015
Apple’s focus on designing iPhone and iPad processors in-house is reportedly expanding with news that CEO Tim Cook’s visit to Israel this week is linked to efforts to increase its own chip design prowess, The Wall Street Journal reported Thursday. Cook earlier in the week met with German Chancellor Angela Merkel.
He met with Israeli President Reuven Rivlin and is expected to meet with former President Shimon Peres later this week. The newspaper added that Apple’ hired most of the Israeli employees of a chip-design division that Texas Instruments shut down in 2013 in Ra’anana, some 10 miles north of Tel-Aviv. Read More
By Christian Zibreg on Jan 28, 2015
News broke today that Samsung’s upcoming flagship, the fabled Galaxy S6, won’t be using Qualcomm’s new mobile system-on-a-chip, the Snapdragon 810.
As Re/code noted, the revelation came indirectly, via Qualcomm’s earnings call today, as the firm had to tell investors “a large customer’s flagship device” won’t be shipping with the Snapdragon 810 inside.
Lost business has forced Qualcomm to cut its outlook for the fiscal year slightly. The semiconductor maker did not say which client, and why, has dropped the Snapdragon 810.
However, a week ago Bloomberg learned that Samsung had opted to drop the 810 from its upcoming flagship due to overheating problems. Read More
By Christian Zibreg on Jan 26, 2015
Apple’s forthcoming S-refresh of the iPhone — let’s call it an ‘iPhone 6s’ — is likely going to run an in-house designed ‘A9’ mobile processor and as much as 75 percent of the chips will be manufactured by Samsung, Reuters reported Monday citing a story in the South Korean newspaper Maeil Business.
Samsung is going to make the chips from its factory in Austin, Texas though it’s unclear how much the contract is worth (likely billions) and which supplier has picked up the remaining 25 percent of orders. Read More
By Christian Zibreg on Jan 15, 2015
Apple supplier Taiwan Semiconductor Manufacturing Co. (TSMC) on Thursday announced record profits in the fourth quarter of 2014 buoyed by its lucrative chip-making deal with Apple for the new iPhones.
In addition, the firm announced migrating to a much finer 10-nanometer process technology this year after being among the first to adopt 20-nanometer chip-making technology in 2014.
According to KGI Securities analyst Ming Chi-Kuo, TSMC would not only pick up 100 percent of orders for Apple’s “A9X” chip, which should be used in an iPad refresh this Fall, but also get to produce an “S2” processor for a second-generation Apple Watch and an “A10” chip that should power a 2016 iPhone model, likely to be called “iPhone 7”. Read More
By Christian Zibreg on Jan 5, 2015
Monday, chip giant Intel took the wraps off a range of “Broadwell-U” processors poised to find their way into a MacBook near you. The fifth-generation Intel Core processor family utilities Intel’s 14-nanometer manufacturing process to deliver more speed and lower power consumption.
The new chips could possibly pave the way to a rumored MacBook Air model with a Retina display measuring twelve inches diagonally (the current Air models come in 11.6 and 13.3-inch varieties). Read More